OM Technology

PCB RELIBILITY TESTING

About OM Technology Inc

OM Technology Inc is a collaboration between Conductor Analysis Technologies and Robisan Laboratory for the purpose of pooling resources, infrastructure and expertise. With this synergy we are confident that the availability of D coupon testing will continue to meet global demands.

Board of Directors

Chris Mahanna | President | chris.mahanna@omtech-usa.com

Nick Meeker | Chairman | nick.meeker@omtech-usa.com

Tim Estes | Chief Technology Officer | tim.estes@omtech-usa.com

OM Thermal Stress System

Performance Based Reliability Test Methodology

Convection reflow assembly simulation per IPC TM-650 2.6.27
Air-to-air thermal shock per IPC TM-650 2.6.7.2

Applications

Product acceptance
Supplier qualification
Design validation
Material studies
Process verification

Advantages

IPC-2221 Appendix A type D coupons
- Web based generator
- 0.550" x 1.875"
- Thickness up to 0.250"
Press-fit headers
- No soldering or cleaning required
Data Acquisition
- 4-wire precision resistance
- 1 reading per net every second
- 24 coupons per chamber load
Software
- Automatic data analysis and report generation
- Simple temperature profile generation
- In-situ temperature calibration using external standard

IPC D Coupons

This coupon generator is based on the D coupons of IPC 2221 Appendix A and the latest IPC 1-10c committee requirements. The generator is owned by Conductor Analysis Technologies and is protected by United States copyright laws and international copyright treaties. Any decompiling, disassembly, or reverse engineering the coupon generator is prohibited.

Terms and Conditions of Use

Conductor Analysis Technologies does not guarantee the proper function of this coupon generator and all coupon designs are provided "as is" without warranty, either expressed or implied, and should be reviewed for accuracy prior to use. By using the coupon generator, you agree to defend, indemnify and hold Conductor Analysis Technologies its officers, directors, employees, agents, licensors and suppliers, harmless from and against any claims, actions or demands, liabilities and settlements including without limitation, reasonable legal and accounting fees, resulting from or alleged to result from, your use of the coupon generator.

GENERATOR

OM Analysis Report

1/11

Suggested Drawing Notes

IPC D COUPON TESTING

A. IPC D COUPONS SHALL BE DESIGNED USING THE COUPON GENERATOR AT WWW.CAT-TEST.INFO. COUPONS SHALL INCLUDE COMPONENT (A), VIA (B) AND ALL PROPAGATED B STRUCTURES IAW IPC-2221 APPENDIX A. 4 OF EACH COUPON DESIGN SHALL BE TESTED PER MANUFACTURING PANEL. ACCEPTANCE SHALL BE BY PANEL.

B. THE IPC D COUPONS SHALL BE SUBJECTED TO 6 REFLOW SIMULATIONS IAW IPC-TM-650, METHOD 2.6.27 USING THE [230C, OR 245C, OR 260C] PROFILE. ACCEPTANCE CRITERIA SHALL BE <5% CHANGE IN RESISTANCE.

C. AFTER REFLOW SIMULATION THE IPC D COUPONS SHALL BE SUBJECTED TO 100 THERMAL SHOCKS IAW IPC-TM-650, METHOD 2.6.7.2 FROM -55C TO [MINIMUM OF (LAMINATE TG - 10C), OR (REFLOW PEAK TEMPERATURE - 25C), OR 210C]. THE LAMINATE TG SHALL BE DETERMINED FROM THE LOWEST VALUE REPORTED FROM THE MATERIAL SUPPLIERS DATA SHEET. ACCEPTANCE CRITERIA SHALL BE <5% CHANGE IN RESISTANCE.

D. RESISTANCE MEASUREMENTS SHALL BE MONITORED AT LEAST EVERY SECOND DURING REFLOW SIMULATION AND AT LEAST ONCE PER CYCLE DURING THERMAL SHOCK.

E. RESULTS FROM ALL D COUPONS TESTED SHALL BE REPORTED.

F. MICRO-SECTIONING OF THE D COUPONS AFTER TESTING IS NOT REQUIRED.

Note: Parameters in red should be tailored to each application.

IPC Warning on Microvias

Summary

“There have been many examples of post fabrication microvia failures over the last several years. Typically, these failures occur during reflow, however they are often undetectable (latent) at room temperature. The further along the assembly process that the failures manifest themselves the more expensive they become. If they remain undetected until after the product is placed into service, they become a much greater cost risk, and more importantly, may pose a safety risk.”

“Many of these failures occurred within products that had already passed traditional production lot acceptance testing in accordance with existing IPC-6010, Printed Board Qualification and Performance Specifications. IPC has been provided with data showing that traditional inspection techniques utilizing thermally stressed microsections and light microscopes alone is no longer an effective quality assurance tool for detecting microvia-to-target plating failures.”